AU02560 uncooled infrared module is equipped with an advanced 256×192 wafer detector with a dimension of 18×18mm. Thanks to its integrated design, it redefines standards in weight, dimension and power consumption (SWaP³) in the OEM module industry, providing excellent miniaturized solutions for consumer products.

*Its resolution is 256×192 and dimension is 18mm×18mm, which are consistent with those of the L384 mechanical interface for compatibility design.

*50Hz imaging to provide a smooth image experience.

*The FOV is 20°~90° and the extension supports multiple interfaces such as DVP/USB/Analog video.