AU02560 uncooled infrared module, adopting an advanced 256×192 wafer detector, features compact dimensions, lightweight design, and low power consumption, meeting the SWaP³ design require ments. The split assembly makes it more flexible to use. It comes with multiple auxiliary development tools that support multiple ARM architecture SOC platforms, ensuring ease of use and integra tion. It also supports the simultaneous output of images and temperature values with a variety of lightweight infrared lenses and extension components. As the best choice for low-cost solutions, this product series can be used in many scenarios such as industry, power, security protection, and machine vision.

*.It adopts the 256x192 WLP detector and weighs only 3.5g with a 3.2mm lens.

*.It supports multiple ARM architecture SOC platforms, capable of directly processing sensor data.

*.It is compatilble with various mainstream embedded SOC platforms and can optimize the image effect of ISP.

*.It provides multiple SDK development interfaces for rapid secondary development.

*.The FOV varies from 20° to 90" and the extension supports multiple protocols such as DvP, MlPl, and analog video.

*.The split design is convenient for integration and development, supporting applications in multiple areas suchas consumer, intelligence, security,and industrial sectors.

256×192 WLP detector 3.5g weight 3.2mm lens